Patent Assignment
Reel/Frame 033810/0796
Assignment of Assignor's Interest
Recorded: 2014-09-24
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2014-09-18
YEH, DER-CHYANG
Executed: 2014-09-19
CHEN, HSIEN-WEI
Executed: 2014-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structures and Methods of Forming