Patent Assignment
Reel/Frame 033812/0203
Assignment of Assignor's Interest
Recorded: 2014-09-24
Pages: 7
Assignors
IM, HOHYEUK
Executed: 2014-09-11
KIM, JONGKOOK
Executed: 2014-09-11
SEONG, GOWOON
Executed: 2014-09-18
LEE, SEOKWON
Executed: 2014-09-18
JANG, BYOUNGWOOK
Executed: 2014-09-12
CHO, EUNSEOK
Executed: 2014-09-18
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same