IP Library Assignment 033814/0788
Patent Assignment
Reel/Frame 033814/0788

Assignment of Assignor's Interest

Recorded: 2014-09-25 Pages: 3
Assignor
FORRAY, DEBORAH
Executed: 2013-02-11
Assignee
HENKEL CORPORATION
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property (1)
Methods for Assembling Thin Semiconductor Die
Patent: 7,645,637 →
Application: 11/581,759 →
Publication: US 2009/0275171
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034186/0588 →
Assignment of Assignor's Interest Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035101/0856 →