Assignment of Assignor's Interest

Recorded: 2014-09-25 Pages: 4

Assignors

NAH, JAE-WOONG

Executed: 2014-09-02

SHIH, DA-YUAN

Executed: 2014-09-14

Assignee

NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504

Covered Property (1)

Copper Post Solder Bumps on Substrates

Patent: 8,877,556 →

Application: 14/016,086 →

Publication: US 2014/0057392