Patent Assignment
Reel/Frame 033829/0308
Assignment of Assignor's Interest
Recorded: 2014-09-26
Pages: 3
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Method of Processing Substrate, Substrate Processing Apparatus, and Program
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.