Patent Assignment
Reel/Frame 033830/0205
Assignment of Assignor's Interest
Recorded: 2014-09-26
Pages: 6
Assignors
AGARWAL, SUMIT
Executed: 2014-09-22
KUO, CHIU-PIEN
Executed: 2014-09-20
HSIEH, SHANG-TING
Executed: 2014-09-19
HONG, GUOCHUAN
Executed: 2014-09-19
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods for Etching a Hardmask Layer for an Interconnection Structure for Semiconductor Applications