Patent Assignment
Reel/Frame 033854/0821
Assignment of Assignor's Interest
Recorded: 2014-09-30
Pages: 3
Assignors
WANG, TSAN-CHUN
Executed: 2014-09-26
TSAI, CHUN HSIUNG
Executed: 2014-09-26
FANG, ZIWEI
Executed: 2014-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC")
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Ion Implantation Methods and Structures Thereof