Patent Assignment
Reel/Frame 033887/0177
Assignment of Assignor's Interest
Recorded: 2014-10-02
Pages: 2
Assignor
SHIGETOSHI, TAKUSHI
Executed: 2014-08-27
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Semiconductor Device, Manufacturing Method Thereof, and Electronic Apparatus