Patent Assignment
Reel/Frame 033891/0866
Assignment of Assignor's Interest
Recorded: 2014-10-06
Pages: 7
Assignors
PARK, JAE-HWA
Executed: 2014-07-30
MOON, KWANG-JIN
Executed: 2014-07-30
BANG, SUK-CHUL
Executed: 2014-07-30
PARK, BYUNG-LYUL
Executed: 2014-07-30
JIN, JEONG-GI
Executed: 2014-07-30
KIM, TAE-SEONG
Executed: 2014-07-30
KANG, SUNG-HEE
Executed: 2014-07-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including a Through-Silicon via Structure and Methods of Fabricating the Same