IP Library Assignment 033910/0031
Patent Assignment
Reel/Frame 033910/0031

Assignment of Assignor's Interest

Recorded: 2014-10-08 Pages: 6
Assignor
RENESAS ELECTRONICS CORPORATION
Executed: 2014-06-19
Assignee
TESSERA ADVANCED TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Method of Forming a Cmos Structure Having Gate Insulation Films of Different Thicknesses
Patent: 9,111,909 →
Application: 14/176,328 →
Publication: US 2014/0252495
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →