Patent Assignment
Reel/Frame 033915/0091
Assignment of Assignor's Interest
Recorded: 2014-10-08
Pages: 4
Assignors
CHIU, TZU-WEI
Executed: 2013-02-18
HSIEH, CHENG-HSIEN
Executed: 2013-02-18
HU, HSIEN-PIN
Executed: 2013-02-19
HSU, KUO-CHING
Executed: 2013-02-21
HOU, SHANG-YUN
Executed: 2013-02-21
JENG, SHIN-PUU
Executed: 2013-02-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
3D Packages and Methods for Forming the Same