Patent Assignment
Reel/Frame 033924/0806
Assignment of Assignor's Interest
Recorded: 2014-10-09
Pages: 15
Assignors
DE BONIS, THOMAS J.
Executed: 2014-08-07
MAY, LILIA
Executed: 2014-06-09
SIDHU, RAJEN S.
Executed: 2014-05-15
RENAVIKAR, MUKUL P.
Executed: 2014-05-21
DANI, ASHAY A.
Executed: 2014-05-22
PRACK, EDWARD R.
Executed: 2014-05-15
DEPPISCH, CARL L.
Executed: 2014-08-07
PRAKASH, ANNA M.
Executed: 2014-10-02
MATAYABAS, JAMES C., JR.
Executed: 2014-05-15
ZHANG, JASON JIEPING
Executed: 2014-05-14
ARAVAMUDHAN, SRINIVASA R.
Executed: 2014-05-14
LIN, CHANG
Executed: 2014-05-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Structure To Enhance Yield of TMI Interconnections