IP Library › Assignment 033925/0591
Patent Assignment
Reel/Frame 033925/0591

Assignment of Assignor's Interest

Recorded: 2014-10-09 Pages: 3
Assignors
LIN, WEN-YI
Executed: 2013-03-25
YEW, MING-CHIH
Executed: 2013-03-25
HONG, CHENG-YI
Executed: 2013-03-25
LIN, PO-YAO
Executed: 2013-03-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Semiconductor Device Package and Method
Patent: 8,941,248 →
Application: 13/800,383 →
Publication: US 2014/0264813
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 9, 2014
From: LIN, WEN-YI; YEW, MING-CHIH; HONG, CHENG-YI; LIN, PO-YAO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 033925/0651 →