Patent Assignment
Reel/Frame 033926/0661
Assignment of Assignor's Interest
Recorded: 2014-10-09
Pages: 6
Assignors
SONG, IN-SANG
Executed: 2014-06-13
KANG, IN-KU
Executed: 2014-06-13
LEE, JOON-HEE
Executed: 2014-09-15
KIM, KYUNG-MAN
Executed: 2014-06-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Forming