Patent Assignment
Reel/Frame 033938/0304
Assignment of Assignor's Interest
Recorded: 2014-10-13
Pages: 3
Assignors
KANEDA, WATARU
Executed: 2014-06-16
SHIMIZU, NORIYOSHI
Executed: 2014-06-16
ROKUGAWA, AKIO
Executed: 2014-06-16
YOKOTA, KAORI
Executed: 2014-06-16
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board