Patent Assignment
Reel/Frame 033946/0660
Assignment of Assignor's Interest
Recorded: 2014-10-14
Pages: 8
Assignors
LEE, HAN SOO
Executed: 2014-10-13
KIM, SUNG JUN
Executed: 2014-10-13
KIM, CHAE RYUNG
Executed: 2014-10-13
PARK, DONG UK
Executed: 2014-10-13
CHUNG, YOUN WOONG
Executed: 2014-10-13
CHOI, JUNG MYUNG
Executed: 2014-10-13
LIM, HAN KYUL
Executed: 2014-10-13
CHA, GYEONG HAN
Executed: 2014-10-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
High-Speed Interface Apparatus and Deskew Method Thereof