Patent Assignment
Reel/Frame 033955/0773
Assignment of Assignor's Interest
Recorded: 2014-10-15
Pages: 5
Assignors
TSENG, HUA-WEI
Executed: 2014-10-03
TU, SHANG-YUN
Executed: 2014-10-07
CHEN, HSU-HSIEN
Executed: 2014-10-07
LIU, HAO-JUIN
Executed: 2014-10-06
CHEN, CHEN-SHIEN
Executed: 2014-10-07
TSENG, MING HUNG
Executed: 2014-10-06
CHUANG, CHITA
Executed: 2014-10-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Manufacturing Method Thereof