Patent Assignment
Reel/Frame 033962/0109
Assignment of Assignor's Interest
Recorded: 2014-10-16
Pages: 7
Assignors
LEE, HEON-BOK
Executed: 2014-10-01
YEO, IN-HO
Executed: 2014-09-30
OH, SAE-CHOON
Executed: 2014-09-30
LEE, SUK-KYUN
Executed: 2014-09-26
LEE, JUNG-HO
Executed: 2014-09-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Forming the Same