Patent Assignment
Reel/Frame 033968/0835
Assignment of Assignor's Interest
Recorded: 2014-10-17
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board, Method for Manufacturing Printed Wiring Board and Package-On-Package