Patent Assignment
Reel/Frame 033969/0055
Assignment of Assignor's Interest
Recorded: 2014-10-17
Pages: 2
Assignors
HUANG, CHANG-CHIA
Executed: 2014-08-25
LIN, TSUNG-SHU
Executed: 2014-08-25
HSIEH, CHENG-CHIEH
Executed: 2014-08-25
WU, WEI-CHENG
Executed: 2014-08-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Contact Pad for Semiconductor Device