Patent Assignment
Reel/Frame 033969/0806
Assignment of Assignor's Interest
Recorded: 2014-10-17
Pages: 7
Assignors
YOU, WOO-KYUNG
Executed: 2014-09-04
RHA, SANG-HO
Executed: 2014-09-11
BAEK, JONG-MIN
Executed: 2014-09-04
AHN, SANG-HOON
Executed: 2014-09-11
LEE, NAE-IN
Executed: 2014-09-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129,SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Wiring Structures and Methods of Fabricating Semiconductor Devices