IP Library › Assignment 033974/0087
Patent Assignment
Reel/Frame 033974/0087

Assignment of Assignor's Interest

Recorded: 2014-10-17 Pages: 3
Assignors
HAN, CALEB C.
Executed: 2014-10-15
JIANG, TONGBI
Executed: 2014-10-15
ZHAI, JUN
Executed: 2014-10-15
Assignee
APPLE INC.
1 INFINITE LOOP, CUPERTINO, CALIFORNIA, 95014
Covered Property (1)
Various Stress Free Sensor Packages Using Wafer Level Supporting Die and Air Gap Technique
Patent: 9,574,959 →
Application: 14/517,387 →
Publication: US 2016/0061677