Patent Assignment
Reel/Frame 033978/0872
Assignment of Assignor's Interest
Recorded: 2014-10-20
Pages: 3
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Semiconductor Device Including Semiconductor Chips Stacked via Relay Substrate