Patent Assignment
Reel/Frame 033994/0836
Assignment of Assignor's Interest
Recorded: 2014-10-21
Pages: 7
Assignors
IM, SEUNGWON
Executed: 2014-10-13
JEON, O-SEOB
Executed: 2014-10-13
SON, JOON-SEO
Executed: 2014-06-12
LEE, KEUN-HYUK
Executed: 2014-06-17
CHOI, YUN-HWA
Executed: 2014-06-15
Assignee
FAIRCHILD KOREA SEMICONDUCTOR, LTD.
82-3, DODANG-DONG, WONMI-KU, PUNCHON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Power Module Having Stacked Flip-Chip and Method for Fabricating the Power Module
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
Release of Security Interest in Patents Recorded at Reel 04481, Frame 0541
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →