Patent Assignment
Reel/Frame 033997/0735
Assignment of Assignor's Interest
Recorded: 2014-10-21
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package Including a Smaller-Area Semiconductor Chip