IP Library › Assignment 034003/0894
Patent Assignment
Reel/Frame 034003/0894

Assignment of Assignor's Interest

Recorded: 2014-10-22 Pages: 2
Assignor
HAUENSTEIN, HENNING M.
Executed: 2006-12-08
Assignee
INTERNATIONAL RECTIFIER CORPORATION
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property (1)
Wafer Scale Package for High Power Devices
Patent: 9,559,068 →
Application: 14/520,270 →
Publication: US 2015/0035120
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Mar 10, 2016
From: INTERNATIONAL RECTIFIER CORPORATION; INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 037943/0440 →
Merger and Change of Name Apr 13, 2016
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.; INTERNATIONAL RECTIFIER CORPORATION; INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 038463/0859 →