Patent Assignment
Reel/Frame 034009/0411
Assignment of Assignor's Interest
Recorded: 2014-10-22
Pages: 5
Assignors
KIM, JIN HWAN
Executed: 2014-09-01
OH, DAE BOK
Executed: 2014-09-01
PARK, JAE YOUNG
Executed: 2014-09-02
TANAKA, ICHIRO
Executed: 2014-09-02
LEE, CHANG HO
Executed: 2014-09-02
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Composite Electronic Component, Method of Manufacturing the Same, Board for Mounting Thereof, and Packaging Unit Thereof
Application:
14/521,116 →
Publication:
US 2015/0340154