Patent Assignment
Reel/Frame 034021/0021
Assignment of Assignor's Interest
Recorded: 2014-10-23
Pages: 5
Assignors
WU, WENG-JIN
Executed: 2014-10-02
YANG, KU-FENG
Executed: 2014-09-29
CHANG, HUNG-PIN
Executed: 2014-09-29
CHIOU, WEN-CHIH
Executed: 2014-09-29
YU, CHEN-HUA
Executed: 2014-10-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Backside Through Vias in a Bonded Structure