IP Library › Assignment 034023/0825
Patent Assignment
Reel/Frame 034023/0825

Assignment of Assignor's Interest

Recorded: 2014-10-23 Pages: 5
Assignors
LE, KRIANGSAK SAE
Executed: 2014-10-20
CHOW, CHEE KAY
Executed: 2014-10-13
Assignee
UNITED TEST AND ASSEMBLY CENTER LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Property (1)
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Patent: 9,312,240 →
Application: 14/521,481 →
Publication: US 2015/0061101
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment. Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment. Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →