Patent Assignment
Reel/Frame 034024/0588
Assignment of Assignor's Interest
Recorded: 2014-10-24
Pages: 2
Assignors
KIM, SUNG HYUN
Executed: 2014-09-29
PARK, MYOUNG SOON
Executed: 2014-09-29
KIM, TAE YOUNG
Executed: 2014-09-29
CHA, HYE YEON
Executed: 2014-09-29
KIM, SUNG HEE
Executed: 2014-09-29
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Electronic Component and Manufacturing Method Thereof