IP Library Assignment 034043/0217
Patent Assignment
Reel/Frame 034043/0217

Assignment of Assignor's Interest

Recorded: 2014-10-27 Pages: 5
Assignors
PEIDOUS, IGOR
Executed: 2014-08-11
PELLICANO, ILLARIA KATIA MARIANNA
Executed: 2014-07-11
Assignee
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
9 BATTERY ROAD, #15-01, STRAITS TRADING BUILDING, SINGAPORE, 049910, SINGAPORE
Covered Property (1)
Method of Manufacturing High Resistivity Soi Wafers with Charge Trapping Layers Based on Terminated Si Deposition
Patent: 9,768,056 →
Application: 14/524,693 →
Publication: US 2015/0115480
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →