IP Library › Assignment 034054/0869
Patent Assignment
Reel/Frame 034054/0869

Assignment of Assignor's Interest

Recorded: 2014-10-28 Pages: 4
Assignors
RIDEAU, DENIS
Executed: 2014-10-27
JOSSE, EMMANUEL
Executed: 2014-10-27
NIER, OLIVIER
Executed: 2014-10-27
Assignees
STMICROELECTRONICS SA
29, BOULEVARD ROMAIN ROLLAND, MONTROUGE, 92120, FRANCE
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, 38926, FRANCE
Covered Property (1)
Method of Forming Stressed Soi Layer
Patent: 9,305,828 →
Application: 14/526,005 →
Publication: US 2015/0118824
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 10, 2023
From: STMICROELECTRONICS (CROLLES 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063276/0569 →
Assignment of Assignor's Interest Apr 10, 2023
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063277/0222 →