Patent Assignment
Reel/Frame 063277/0222
Assignment of Assignor's Interest
Recorded: 2023-04-10
Pages: 15
Assignor
STMICROELECTRONICS SA
Executed: 2023-01-23
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Properties
(42)
Dual Static Electro-Optical Phase Shifter Having Two Control Terminals
Positive Coefficient Dynamic Electro-Optical Phase Shifter
Positive Coefficient Dynamic Electro-Optical Phase Shifter
Static Electro-Optical Phase Shifter Having a Dual Pin Junction
Method of Locally Stressing a Semiconductor Layer
Dynamic Esd Protection Device Adapted to Electro-Optical Devices
Esd Protection Thyristor Adapted to Electro-Optical Devices
Electronic Device for Esd Protection
Programming of Antifuse Cells
Multi-Orientation Integrated Cell, in Particular Input/Output Cell of an Integrated Circuit
Extended-Drain Mos Transistor in a Thin Film on Insulator
Method of Minimizing the Operating Voltage of an Sram Cell
Method of Introducing Local Stress in a Semiconductor Layer
High Data Rate Serial Link
Photodetector on Silicon-On-Insulator
Optical Waveguide to Be Carried by a Semiconductor Material Including a Plurality of Parallel Strips of Alternating Conductivity Types and Related Methods
Process for Producing a Microfluidic Circuit Within a Three-Dimensional Integrated Structure, and Corresponding Structure
Image Sensor with Reduced Spectral and Optical Crosstalk and Method for Making the Image Sensor
Image Sensor with Reduced Spectral and Optical Crosstalk and Method for Making the Image Sensor
Front-Side Imager Having a Reduced Dark Current on Soi Substrate
Electronic Device and Protection Circuit
Electronic Device for ESD Protection
Electronic Device for ESD Protection
Electronic Device for Esd Protection
Electronic Device for Esd Protection
Pinned Dynamic Electro-Optical Phase Shifter
Pinned Dynamic Electro-Optical Phase Shifter
Method and Device for Controlling an Apparatus Using Several Distance Sensors
Method of Stressing a Semiconductor Layer
Method of Forming Stressed Soi Layer
Method of Forming Stressed Semiconductor Layer
High Frequency Attenuator
Pmos Transistor with Improved Mobility of the Carriers
Imager Having a Reduced Dark Current Through an Increased Bulk Doping Level
Method of Manufacturing a Photonic Integrated Circuit Optically Coupled to a Laser of Iii-V Material
Semiconductor Device and Wafer with Reference Circuit and Related Methods
Semiconductor Device and Wafer with Reference Circuit and Related Methods
Electro-Optic (E/O) Device with an E/O Amplitude Modulator and Associated Methods
Method for Searching for a Similar Image in an Image Database Based on a Reference Image
Method for Processing Signals Originating from One or More Sensors, in Particular Proximity Sensors, for the Recognition of a Movement of an Object and Corresponding Device
Method for Adjusting at Least One Operating Point of at Least One Integrated Circuit of a System on a Chip, and Corresponding System on a Chip
Electrostatic Discharge (Esd) Protection for a High Side Driver Circuit
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 12, 2014
From: MANOUVRIER, JEAN-ROBERT
To: STMICROELECTRONICS SA
Reel/Frame 032867/0725 →
Assignment of Assignor's Interest
May 12, 2014
From: MANOUVRIER, JEAN-ROBERT
To: STMICROELECTRONICS SA
Reel/Frame 032867/0772 →
Assignment of Assignor's Interest
May 21, 2014
From: MANOUVRIER, JEAN-ROBERT
To: STMICROELECTRONICS SA
Reel/Frame 032939/0180 →
Assignment of Assignor's Interest
Aug 4, 2014
From: MORIN, PIERRE; RIDEAU, DENIS; NIER, OLIVIER
To: STMICROELECTRONICS SA; STMICROELECTRONICS, INC.
Reel/Frame 033458/0847 →
Assignment of Assignor's Interest
Sep 3, 2014
From: GALY, PHILIPPE; BOURGEAT, JOHAN
To: STMICROELECTRONICS SA
Reel/Frame 033655/0797 →
Assignment of Assignor's Interest
Oct 27, 2014
From: LITTY, ANTOINE; ORTOLLAND, SYLVIE
To: STMICROELECTRONICS SA
Reel/Frame 034035/0616 →
Assignment of Assignor's Interest
Feb 20, 2015
From: RAUBER, BRUNO
To: STMICROELECTRONICS SA
Reel/Frame 034991/0183 →
Assignment of Assignor's Interest
Mar 5, 2015
From: MANOUVRIER, JEAN-ROBERT; BATAIL, ESTELLE
To: STMICROELECTRONICS SA; STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 035095/0250 →
Assignment of Assignor's Interest
Mar 5, 2015
From: MANOUVRIER, JEAN-ROBERT; BATAIL, ESTELLE
To: STMICROELECTRONICS SA; STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 035091/0270 →
Assignment of Assignor's Interest
Mar 16, 2015
From: MANOUVRIER, JEAN-ROBERT; LEMAITRE, PATRICK; CARPENTIER, JEAN-FRANCOIS
To: STMICROELECTRONICS SA; STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 035171/0206 →
Assignment of Assignor's Interest
Jul 30, 2015
From: LECOCQ, CHRISTOPHE; AKYEL, KAYA CAN; CHHABRA, AMIT; DIPTI, DIBYA
To: STMICROELECTRONICS SA; STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 036215/0070 →
Assignment of Assignor's Interest
Aug 7, 2015
From: GALY, PHILIPPE
To: STMICROELECTRONICS SA
Reel/Frame 036279/0154 →
Assignment of Assignor's Interest
Sep 3, 2015
From: LACOUTURE, STEPHANE; DAMIENS, JOEL
To: STMICROELECTRONICS SA
Reel/Frame 036488/0251 →
Assignment of Assignor's Interest
Sep 28, 2015
From: DRAY, ALEXANDRE; JOSSE, EMMANUEL
To: STMICROELECTRONICS SA; STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 036673/0925 →
Assignment of Assignor's Interest
Nov 23, 2015
From: MORIN, PIERRE; RIDEAU, DENIS; NIER, OLIVIER
To: STMICROELECTRONICS SA; STMICROELECTRONICS, INC.
Reel/Frame 037121/0535 →
Assignment of Assignor's Interest
Dec 3, 2015
From: BAR, PIERRE; COUDRAIN, PERCEVAL
To: STMICROELECTRONICS SA
Reel/Frame 037205/0073 →
Assignment of Assignor's Interest
Nov 10, 2022
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061915/0364 →
Assignment of Assignor's Interest
Apr 10, 2023
From: STMICROELECTRONICS (CROLLES 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063276/0569 →