Patent Assignment
Reel/Frame 061915/0364
Assignment of Assignor's Interest
Recorded: 2022-11-10
Pages: 15
Assignor
STMICROELECTRONICS, INC.
Executed: 2022-11-08
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Properties
(54)
Energy Saving Circuits and Methods for Multimedia Over Coaxial Alliance (Moca) Capable Devices
Adaptive Uniform Polishing System
Semiconductor Device with Relaxation Reduction Liner and Associated Methods
Method of Making a Cmos Semiconductor Device Using a Stressed Silicon-on-Insulator (Soi) Wafer
Semiconductor-On-Insulator (Soi) Device and Related Methods for Making Same Using Non-Oxidizing Thermal Treatment
Method for the Formation of Dielectric Isolated Fin Structures for Use, for Example, in Finfet Devices
Method for the Formation of a Finfet Device with Epitaxially Grown Source-Drain Regions Having a Reduced Leakage Path
Method to Form Strained Channel in Thin Box Soi Structures by Elastic Strain Relaxation of the Substrate
Power Converter for Interfacing a Fluorescent Lighting Ballast to a Light Emitting Diode Lamp
Control of Wafer Surface Charge During Cmp
Automatic Gain and Offset Compensation for an Electronic Circuit
Current Modulation Circuit
Fixed Gain Amplifier Circuit
Method of Introducing Local Stress in a Semiconductor Layer
Method of Locally Stressing a Semiconductor Layer
Method and Apparatus for Inductive Coupling Utilizing an Amorphous Metal Barrier
Method and Apparatus for Managing Provisioning of an Imaging System
Method of Stressing a Semiconductor Layer
Method of Forming Stressed Semiconductor Layer
Silicon Carbide Static Induction Transistor and Process for Making a Silicon Carbide Static Induction Transistor
Patent:
9,224,845 →
Application:
14/538,877 →
Zero Standby Power for Powerline Communication Devices
Powerline Communications Automotive Network
Electronic Device for Communicating Between a Microcontroller Unit (Mcu) and a Host Processor and Related Methods
Semiconductor Device with Fin and Related Methods
Method of Making a Cmos Semiconductor Device Using a Stressed Silicon-on-Insulator (Soi) Wafer
Vertical Gate-All-Around Tfet
Patent:
9,385,195 →
Application:
14/675,536 →
Method for the Formation of a Finfet Device with Epitaxially Grown Source-Drain Regions Having a Reduced Leakage Path
Silicon Carbide Static Induction Transistor and Process for Making a Silicon Carbide Static Induction Transistor
Semiconductor-On-Insulator (Soi) Device and Related Methods for Making Same Using Non-Oxidizing Thermal Treatment
Fixed Gain Amplifier Circuit
Method to Form Strained Channel in Thin Box Soi Structures by Elastic Strain Relaxation of the Substrate
Multipath Switching Using Per-Hop Virtual Local Area Network Classification
Zero Standby Power for Powerline Communication Devices
Scheduling for Orthogonal Frequency Division Multiple Access (Ofdma) Transmissions in a Wireless Local Area Network (Wlan)
Control of Wafer Surface Charge During Cmp
Method of Making a Cmos Semiconductor Device Using a Stressed Silicon-on-Insulator (Soi) Wafer
Vertical Gate-All-Around Tfet
Semiconductor Device with Fin and Related Methods
Microfluidic Assembly and Methods of Forming Same
Vertical Gate-All-Around Tfet
Method to Form Strained Channel in Thin Box Soi Structures by Elastic Strain Relaxation of the Substrate
Semiconductor Device with Fin and Related Methods
Color Pixel and Range Pixel Combination Unit
Powerline Communications Automotive Network
Microfluidic Assembly and Methods of Forming Same
Vertical Gate-All-Around Tfet
Method and Apparatus for Managing Provisioning of an Imaging System
Method of Making a Cmos Semiconductor Device Using a Stressed Silicon-on-Insulator (Soi) Wafer
Semiconductor Device with Fin and Related Methods
Method and Apparatus for Quick Prototyping of Embedded Peripherals
Vertical Gate-All-Around Tfet
Semiconductor Device with Fin and Related Methods
Method and Apparatus for Quick Prototyping of Embedded Peripherals
Semiconductor Device with Fin and Related Methods
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 26, 2013
From: ZHANG, JOHN H.
To: STMICROELECTRONICS, INC.
Reel/Frame 031285/0805 →
Assignment of Assignor's Interest
Oct 15, 2013
From: LIU, QING; LOUBET, NICOLAS
To: STMICROELECTRONICS, INC.
Reel/Frame 031405/0128 →
Assignment of Assignor's Interest
Oct 15, 2013
From: MORIN, PIERRE; LIU, QING; LOUBET, NICOLAS
To: STMICROELECTRONICS, INC.
Reel/Frame 031405/0087 →
Assignment of Assignor's Interest
Oct 15, 2013
From: MORIN, PIERRE; LIU, QING; LOUBET, NICOLAS
To: STMICROELECTRONICS, INC.
Reel/Frame 031404/0961 →
Assignment of Assignor's Interest
Dec 5, 2013
From: LOUBET, NICOLAS; KHARE, PRASANNA
To: STMICROELECTRONICS, INC.
Reel/Frame 031722/0529 →
Assignment of Assignor's Interest
Dec 5, 2013
From: LOUBET, NICOLAS; MONFRAY, STEPHANE; SAMPSON, RONALD K
To: STMICROELECTRONICS, INC.; STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 031722/0476 →
Assignment of Assignor's Interest
Mar 26, 2014
From: STAMM, THOMAS; SHAO, JIANWEN
To: STMICROELECTRONICS, INC.
Reel/Frame 032532/0767 →
Assignment of Assignor's Interest
Apr 4, 2014
From: ZHANG, JOHN H.
To: STMICROELECTRONICS, INC.
Reel/Frame 032605/0669 →
Assignment of Assignor's Interest
Apr 17, 2014
From: KIM, FELIX; LYSINGER, MARK A.; HO, SCOTT V.
To: STMICROELECTRONICS, INC.
Reel/Frame 032700/0494 →
Assignment of Assignor's Interest
May 6, 2014
From: YOUSSEF, TOM; GASPARINI, ALESSANDRO; HU, YAMU; SAHOO, NAREN K.
To: STMICROELECTRONICS, INC.; STMICROELECTRONICS S.R.L.
Reel/Frame 032830/0368 →
Assignment of Assignor's Interest
Jun 2, 2014
From: MORIN, PIERRE
To: STMICROELECTRONICS INC.
Reel/Frame 033006/0683 →
Assignment of Assignor's Interest
Jun 5, 2014
From: CHOI, DAVY
To: STMICROELECTRONICS, INC.
Reel/Frame 033038/0982 →
Assignment of Assignor's Interest
Aug 4, 2014
From: MORIN, PIERRE; RIDEAU, DENIS; NIER, OLIVIER
To: STMICROELECTRONICS SA; STMICROELECTRONICS, INC.
Reel/Frame 033458/0847 →
Assignment of Assignor's Interest
Oct 7, 2014
From: PROEHL, GREGORY
To: STMICROELECTRONICS, INC.
Reel/Frame 033900/0063 →
Assignment of Assignor's Interest
Jan 14, 2015
From: LOGVINOV, OLEG; ALLEN, JAMES D.
To: STMICROELECTRONICS, INC.
Reel/Frame 034714/0789 →
Assignment of Assignor's Interest
May 22, 2015
From: MALHOTRA, TANU
To: STMICROELECTRONICS, INC.
Reel/Frame 035699/0254 →
Assignment of Assignor's Interest
Nov 23, 2015
From: MORIN, PIERRE; RIDEAU, DENIS; NIER, OLIVIER
To: STMICROELECTRONICS SA; STMICROELECTRONICS, INC.
Reel/Frame 037121/0535 →
Assignment of Assignor's Interest
Nov 1, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061828/0243 →
Assignment of Assignor's Interest
Apr 10, 2023
From: STMICROELECTRONICS (CROLLES 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063276/0569 →
Assignment of Assignor's Interest
Apr 10, 2023
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063277/0222 →