Semiconductor device with fin and related methods

1. A device, comprising:

a substrate;

a dielectric layer over the substrate;

a channel region over the dielectric layer, the channel region extending in a first direction;

a gate structure overlapping the channel region, the gate structure extending along a second direction that is at an oblique angle to the first direction; and

a source region and a drain region on opposite sides of the channel region, the source region and the drain region extending in the second direction and contacting sidewalls of the channel region and sidewalls of the dielectric layer.

2. The device of claim 1 , wherein the source region and the drain region comprise silicon germanium.

3. The device of claim 1 , wherein the channel region comprises silicon germanium or silicon.

4. The device of claim 1 , wherein the channel region is canted at an angle from 22.5 degrees to 67.5 degrees with respect to the source region and the drain region.

5. The device of claim 1 , wherein the channel region is canted at an angle within a range from 40 degrees to 50 degrees.

6. The device of claim 1 , wherein the source region and drain region each contact the substrate.

7. The device of claim 1 , wherein the sidewalls of the channel region and the sidewalls of the dielectric layer are aligned with respect to one another.

8. A device, comprising:

a substrate;

a dielectric layer over the substrate;

a plurality of channel regions over the dielectric layer, the plurality of channel regions each extending in a first direction;

a plurality of gate structures each overlapping a corresponding channel region of the plurality of channel regions, the plurality of gate structures each extending along a second direction that is at an oblique angle to the first direction; and

source and drain regions between the plurality of gate structures, the source and drain regions extending in the second direction from a surface of the substrate.

9. The device of claim 8 , wherein each of the plurality of channel regions is canted at an angle of within a range from 22.5 degrees to 67.5 degrees with respect to the source and drain regions.

10. The device of claim 8 , wherein the substrate comprises silicon.

11. The device of claim 8 , wherein the source and drain regions contact sidewalls of the dielectric layer.

12. The device of claim 8 , wherein the source and drain regions comprise an epitaxial semiconductor layer.

13. The device of claim 8 , wherein the plurality of gate structures are arranged substantially in parallel with respect to one another.

14. The device of claim 8 , wherein the plurality of channel regions each comprises silicon germanium or silicon.

15. A structure, comprising:

a substrate;

a dielectric layer over the substrate;

a semiconductor fin over the dielectric layer, the semiconductor fin extending in a first direction;

a gate structure over the semiconductor fin, the gate structure extending in a second direction that is canted with respect to the first direction;

two recesses on opposite sides of the gate structure, the two recesses each extending into the dielectric layer toward the substrate; and

an epitaxial semiconductor layer in each of the two recesses.

16. The structure of claim 15 , wherein the epitaxial semiconductor layer contacts a sidewall surface of the semiconductor fin.

17. The structure of claim 15 , wherein the epitaxial semiconductor layer contacts the substrate.

18. The structure of claim 17 , wherein the fin structure is canted at an angle of within a range from 22.5 degrees to 67.5 degrees with respect to the epitaxial semiconductor layer.

19. The structure of claim 15 , wherein the epitaxial semiconductor layer is silicon germanium.

20. The structure of claim 15 , wherein the two recesses are substantially in parallel with the gate structure.