IP Library › Assignment 034063/0560
Patent Assignment
Reel/Frame 034063/0560

Assignment of Assignor's Interest

Recorded: 2014-10-29 Pages: 4
Assignors
LEUNG, CHI HO
Executed: 2014-10-28
HOR, WAI HUNG WILLIAM
Executed: 2014-10-28
HABENICHT, SOENKE
Executed: 2014-10-28
UMALI, POMPEO
Executed: 2014-10-28
HO, WAIKEUNG
Executed: 2014-10-28
FUNG, YEE WAI
Executed: 2014-10-28
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, NL-5656 AG, NETHERLANDS
Covered Property (1)
Package with Multiple I/O Side-Solderable Terminals
Patent: 9,425,130 →
Application: 14/527,365 →
Publication: US 2016/0126162
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 8, 2016
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 039610/0734 →
Release of Security Interest Feb 13, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 048328/0964 →