IP Library › Assignment 034091/0206
Patent Assignment
Reel/Frame 034091/0206

Assignment of Assignor's Interest

Recorded: 2014-11-03 Pages: 4
Assignors
WANG, YI-XIANG
Executed: 2014-10-21
DOU, JUYING
Executed: 2014-10-21
KANAI, KENICHI
Executed: 2014-10-20
Assignee
HERMES MICROVISION INC.
7F, NO.18, PUDING RD., EAST DIST., HSINCHU CITY, 300, TAIWAN
Covered Property (1)
Wafer Grounding and Biasing Method, Apparatus, and Application
Patent: 9,991,147 →
Application: 14/531,263 →
Publication: US 2015/0049411
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →