Patent Assignment
Reel/Frame 034099/0204
Assignment of Assignor's Interest
Recorded: 2014-11-04
Pages: 4
Assignors
KIM, SEUNG JEE
Executed: 2014-10-28
CHUNG, QWAN HO
Executed: 2014-10-28
NAM, JONG HYUN
Executed: 2014-10-28
KIM, SI HAN
Executed: 2014-10-28
LEE, SANG YONG
Executed: 2014-10-28
SHIN, SEONG CHEOL
Executed: 2014-10-28
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Packages Having Bumps and Methods of Manufacturing the Same