Patent Assignment
Reel/Frame 034101/0808
Assignment of Assignor's Interest
Recorded: 2014-11-04
Pages: 7
Assignors
SUGIHARA, SHINTARO
Executed: 2014-10-16
FURUYA, HAJIME
Executed: 2014-10-20
FURUTANI, GORO
Executed: 2014-10-20
IWAMOTO, YASUNOBU
Executed: 2014-10-20
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Device and Bonding System