IP Library Assignment 034110/0712
Patent Assignment
Reel/Frame 034110/0712

Assignment of Assignor's Interest

Recorded: 2014-11-05 Pages: 9
Assignors
GRINMAN, ANDREY
Executed: 2007-02-12
OVRUTSKY, DAVID
Executed: 2007-02-12
ROSENSTEIN, CHARLES
Executed: 2007-02-12
OGANESIAN, VAGE
Executed: 2007-02-13
Assignee
TESSERA, INC.
3099 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Packaged Semiconductor Chips with Array
Patent: 9,070,678 →
Application: 14/177,527 →
Publication: US 2014/0151881
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 2, 2015
From: GRINMAN, ANDREY; OVRUTSKY, DAVID; ROSENSTEIN, CHARLES; OGANESIAN, VAGE
To: TESSERA, INC.
Reel/Frame 034866/0086 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073657/0979 →
Change of Name Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0661 →