Patent Assignment
Reel/Frame 034117/0801
Assignment of Assignor's Interest
Recorded: 2014-11-06
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Finfets and Local Interconnect Layers and Methods of Fabricating the Same