Patent Assignment
Reel/Frame 034126/0502
Assignment of Assignor's Interest
Recorded: 2014-11-07
Pages: 3
Assignor
MACHIDA, YOSHIHIRO
Executed: 2014-10-07
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Intermetallic Compound Layer on a Pillar Between a Chip and Substrate