Patent Assignment
Reel/Frame 034130/0244
Assignment of Assignor's Interest
Recorded: 2014-11-07
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package with Reduced via Hole Width and Reduced Pad Patch and Manufacturing Method Thereof