Patent Assignment
Reel/Frame 034133/0721
Assignment of Assignor's Interest
Recorded: 2014-11-10
Pages: 6
Assignors
LEE, KEUNHYUK
Executed: 2014-10-06
JEON, OSEOB
Executed: 2014-10-13
SON, JOON-SEO
Executed: 2014-10-13
IM, SEUNGWON
Executed: 2014-10-13
Assignee
FAIRCHILD KOREA SEMICONDUCTOR, LTD.
55, PYEONGCHEON-RO 850 BEON-GIL, WONMI-GU, BUCHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Power Module Package
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest in Patents Recorded at Reel 04481, Frame 0541
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →