Patent Assignment
Reel/Frame 034150/0500
Assignment of Assignor's Interest
Recorded: 2014-11-03
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Trench-Shaped Opening and Methods for Fabricating the Same