Patent Assignment
Reel/Frame 034150/0804
Assignment of Assignor's Interest
Recorded: 2014-11-12
Pages: 6
Assignors
KIM, DAE-IK
Executed: 2014-06-17
KIM, HYOUNG-SUB
Executed: 2014-06-17
HWANG, YOO-SANG
Executed: 2014-06-17
KIM, JI-YOUNG
Executed: 2014-10-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Semiconductor Devices Having Buried Contacts and Related Semiconductor Devices