Patent Assignment
Reel/Frame 034154/0366
Assignment of Assignor's Interest
Recorded: 2014-11-12
Pages: 4
Assignors
MOON, SEON HEE
Executed: 2014-01-22
KWEON, YOUNG DO
Executed: 2014-01-22
LEE, JEONG HO
Executed: 2014-01-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Embedded Board and Method of Manufacturing the Same