Patent Assignment
Reel/Frame 034155/0533
Assignment of Assignor's Interest
Recorded: 2014-11-12
Pages: 6
Assignors
LIN, CHAO-HUNG
Executed: 2014-11-05
TSAI, SHIH-HUNG
Executed: 2014-11-05
FU, SSU-I
Executed: 2014-11-05
HUANG, CHIH-SEN
Executed: 2014-11-05
FENG, LI-WEI
Executed: 2014-11-05
JENQ, JYH-SHYANG
Executed: 2014-11-05
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Manufacturing Method of Semiconductor Structure for Preventing Surface of Fin Structure from Damage and Providing Improved Process Window
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.