Patent Assignment
Reel/Frame 034157/0958
Assignment of Assignor's Interest
Recorded: 2014-11-12
Pages: 6
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
High Density Interconnect Device and Method
Application:
14/518,421 →
Publication:
US 2015/0035144
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.