Patent Assignment
Reel/Frame 034164/0974
Assignment of Assignor's Interest
Recorded: 2014-11-13
Pages: 3
Assignors
SCHULZE, HANS-JOACHIM
Executed: 2014-09-10
LAVEN, JOHANNES
Executed: 2014-09-10
DAINESE, MATTEO
Executed: 2014-09-10
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Method of Forming a Semiconductor Substrate With Buried Cavities and Dielectric Support Structures